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MP03 XX 260 Series
MP03 XX 260 Series
Dual Diode Modules
Replaces December 1998 version, DS5104-2.0 DS5104-3.0 January 2000
FEATURES s Dual Device Module s Electrically Isolated Package s Pressure Contact Construction s International Standard Footprint s Alumina (non-toxic) Isolation Medium
Code
KEY PARAMETERS VRRM 1600V IFSM 8100A 267A IF(AV) (per arm) Visol 2500V CIRCUIT OPTIONS
Circuit
APPLICATIONS s Rectifier Bridges s DC Power Bridges s Plating Rectifiers s Traction Systems
HB
G
GN
VOLTAGE RATINGS
Type Number Repetitive Peak Voltages VRRM 1600 1400 1200 1000
Module outline type code: MP03. See Package Details for further information.
Conditions
PACKAGE OUTLINE
MP03/260-16 MP03/260-14 MP03/260-12 MP03/260-10
Tvj = 150oC IRM = 30mA VRSM = VRRM + 100V
Lower voltage grades available. For full description of part numbers see "Ordering instructions" on page 3.
CURRENT RATINGS - PER ARM
Symbol Parameter Conditions Tcase = 75oC Tcase = 85oC IF(AV) Mean forward current Halfwave, resistive load Theatsink = 75oC Theatsink = 85oC IF(RMS) RMS value Tcase = 75oC Max. 267 240 235 211 420 Units A A A A A
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MP03 XX 260 Series
SURGE RATINGS - PER ARM
Symbol IFSM Parameter Surge (non-repetitive) forward current Conditions V =0 10ms half sine; R Tj = 150C VR = 50% VRRM 10ms half sine; Tj = 150C VR = 50% VRRM VR = 0 Max. 8100 6500 328000 211000 Units A A A2s A2s
I2t
I2t for fusing
THERMAL & MECHANICAL RATINGS
Symbol Parameter dc Rth(j-c) Thermal resistance - junction to case per Diode Thermal resistance - case to heatsink per Diode Virtual junction temperature Storage temperature range Isolation voltage Commoned terminals to base plate AC RMS, 1min, 50Hz halfwave 3 phase Rth(c-hs) Tvj Tsto Visol Mounting torque = 5Nm with mounting compound Conditions Max. 0.21 0.22 0.23 0.05 150 -40 to 150 2.5 Units
o
C/W C/W C/W
o
o
o
C/W
o
C C
o
kV
CHARACTERISTICS
Symbol VFM IRM VTO rT Parameter Forward voltage Peak reverse current Threshold voltage On-state slope resistance Conditions At 600A, Tcase = 25oC At VRRM, Tj = 150oC At Tvj = 150oC At Tvj = 150oC Max. 1.3 30 0.84 0.667 Units V mA V m
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MP03 XX 260 Series
ORDERING INSTRUCTIONS
Part number is made up as follows: MP03 HB 260 - 16 MP 03 HB 260 16 = Pressure contact module = Outline type = Circuit configuration code (see "circuit options" - front page) = Nominal average current rating at Tcase = 75oC = VRRM/100
Examples: MP03 HB260-10 MP03 G260-14 MP023GN260-12 Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of VTO and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32in) and a flatness within 0.05mm (0.002") are recommended. Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 5Nm (44lb.ins) is reached at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module.
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MP03 XX 260 Series
CURVES
2500
2000
Instantaneous forward current IF - (A)
1500
1000
500
Tj = 150C
0 0.5
1.0 1.5 2.0 Instantaneous forward voltage IF - (V)
Fig. 1 Maximum (limit) forward characteristics (Per diode)
0.3
Thermal Impedance - (C/W)
Rth(j-hs) 0.2
Rth(j-c)
0.1
0 0.001
0.010
0.100
Time - (s)
1.0
10
100
Fig. 2 Transient thermal impedance (DC) - (Per diode)
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MP03 XX 260 Series
15000
Peak half sine wave forward current - (A)
12500 I2t 10000
22 20
I2t value - A2s x 104
7500
18 16
5000 14 2500 12 10 20 30 50
0
1 ms
10
1
23 5
10
cycles at 50Hz Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150C)
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MP03 XX 260 Series
500 d.c. 450 400 350 300 250 200 150 100 50 0 60 Rectangular 180 Rectangular 180 Sine 120 Rectangular
On-state power loss per device - (W)
0
50
100
150
200 250 Mean forward current - (A)
300
350
400
425
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
160
Maximum permissible case temperature - (C)
140 120 100 80
120 Rectangular 180 Rectangular
40 20 0 0 50 100 150
60 Rectangular
60
d.c.
180 Sine
200 250 Forward current - (A)
300
350
400
425
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
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MP03 XX 260 Series
1400 0.04 1200 1000 0.08 800 600 400 200 00 0.10 0.12 0.15 0.20 0.30 0.40 0.02 0.01 Rth(hs-a) C/W R- Load
Total power - (W)
L- Load
40 80 100 120 140 20 60 Maximum ambient temperature - (C)
0
200 400 D.C. output current - (A)
600
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1400 1200 1000 800 600 0.10 0.12 0.15
0.08
0.04
0.02 0.01 Rth(hs-a) C/W
R & L - Load
Total power - (W)
0.20 400 0.30 200 00 0.40
40 80 100 120 140 20 60 Maximum ambient temperature - (C)
160
0
200 400 D.C. output current - (A)
500
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
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MP03 XX 260 Series
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 42.5 4 holes O5.5 35 28.5 5
50 38
18
80 2x M8 2 3
1
52 32
92 Recommended fixings for mounting: Recommended mounting torque: Recommended torque for electrical connections: Maximum torque for electrical connections: Nominal weight: 950g Module outline type code: MP03 M5 socket head cap screws. 5Nm (44lb.ins) 8Nm (70lb.ins) 9Nm (80lb.ins)
CIRCUIT CONFIGURATIONS
1 2 HB 3
1
G
2
3
1
2
GN
3
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MP03 XX 260 Series
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS5104-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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